1948
Gründung als Fa. Kopp in Pforzheim
1955
Umzug nach Niefern und Umfirmierung zu Kopp & Odenwald
1975
Übernahme durch die Degussa AG und Umfirmierung zur Degussa Präzisionstechnik GmbH
1996
Management-buy-out – Gründung der pretema GmbH
2001
Übernahme durch die Tyco Electronics AMP GmbH
2010
Übernahme durch die L. Possehl & Co. mbH und erneute Firmierung als pretema GmbH
2011
pretema wird Führungsgesellschaft der Possehl Electronics
2016
Der Automotive-Bereich der pretema GmbH wurde zum 1. August 2016 von der pretema GmbH abgespalten und ist in die Possehl Electronics Deutschland GmbH übergegangen
1948
Establishment of Kunststoff-Verarbeitung Johann Wilden in Weiden
1989
Establishment of the site in Wackersdorf
2003
Establishment of the site in Dýšina, Czech Republic
2006
Establishment of the site in Puebla, Mexico
2007
Acquisition of Wilden AG by Gerresheimer AG
2008
Spin-off of Technical Plastic Systems GmbH from Gerresheimer AG
2009
Acquisition of Technical Plastic Systems GmbH by the FBH Group
2011
Establishment of the site at Wujiang, China
2012
Extension of the toolmaking division by the acquisition of the company Auer-Formenbau in Fürth
2014
Acquisition of Technical Plastic Systems GbmH by Possehl Group
2016
Dispostion of Auer-Formenbau
2017
Renaming of Technical Plastics Sytems Wackersdorf location into Possehl Electronics Wackersdorf GmbH on 1. April 2017
1954
Possehl Electronics starts operations from Wedel (Germany)
1991
Possehl acquires Meco Metal Finishing Engineers BV in ’s-Hertogenbosch, The Netherlands
1996
Possehl establishes Possehl Maroc
1997
PEHL BESI ELECTRONICS NV set up as a joint venture of L Possehl , GHL and BESI
1998
PBE NV acquires Meco Illinois
2001
Change in shareholding structure. Remaining shareholders are L. Possehl and GHL, and company renames Possehl Electronics N.V.
2003
Establishment of the site Technické plastové systémy s.r.o in Dýšina, Czech Republic
2017
Renaming of Technické plastové systémy s.r.o Dýšina location into Possehl Electronics Czech Republic s.r.o. on 1. April 2017
1973
Establishment of ADE (Atelier de Découpage pour l’Electronique)
1982
Possehl takes over ADE, renaming it Possehl Electronics France SA
1995
Possehl splits Hong Kong facility into two companies:
Possehl Electronics Hong Kong Precision Machinery Ltd (automated leadframe processing machines)
Possehl Precision Tooling Co in Shenzhen (China)
1999
PBE NV starts construction of production facility in Shenzhen (China)
2001
Change in shareholding structure. Remaining shareholders are L. Possehl and GHL, and company renames Possehl Electronics N.V.
2007
New production facility, Dongguan Possehl SEG Electronics Co Ltd, in Machong, Dongguan is fully operational
2011
Disposition of Shenzen site
1980
MECO Metal Finishing Engineers (H.K.) Limited was established by MECO International BV, a leading supplier of reel to reel electroplating equipment to serve the lead frame plating production and semiconductor market in North Asia.
1955
MECO International BV, along with Meco Metal Finishing Engineers (H.K.) Limited was acquired by Berliner Electro Semiconductor Industries (BESI).
1998
BESI and Possehl Electronics merged, combine the operations in Hong Kong and changed the name to Possehl Besi Electronics Hong Kong Limited.
2001
Possehl Electronics Hong Kong Limited was renamed from Possehl Besi Electronics Hong Kong Limited.
1990
Meco establishes the plating company, Meco Metal Finishing Engineers (M) Snd Bhd Malaysia
2000
PBE NV merges Meco Malaysia with Possehl Malaysia forming Possehl Besi Electronics Malaysia Sdn Bhd
2001
Change in shareholding structure. Remaining shareholders are L. Possehl and GHL, and company renames Possehl Electronics
1991
Possehl starts leadframe stamping in Malaysia and Singapore and Possehl acquires Meco Metal Finishing Engineers BV in ’s-Hertogenbosch, The Netherlands
1994
Possehl Electronics Singapore Pte Ltd becomes Possehl Sumiko Electronics Singapore Pte Ltd
2000
PBE NV acquires all shares of Possehl Sumiko Electronics Singapore Pte Ltd renaming it Possehl Besi Electronics Singapore Pte Ltd
2001
Change in shareholding structure. Remaining shareholders are L. Possehl and GHL, and company renames Possehl Electronics N.V.
1987
MECO Metal Finishing USA, Inc. was formed in Rock Hill, SC by MECO International BV, a leading supplier of reel to reel electroplating equipment, to service the commission plating market in the US
1995
MECO International BV, along with Meco Metal Finishing USA, Inc. was acquired by Berliner Electro Semiconductor Industries (BESI)
1997
MECO Metal Finishing, USA is acquired by L. Possehl & Co. mbH and became part of Possehl Electronics
1998
MECO Metal Finishing, USA purchases Cinch Connector in Elk Grove Village, IL. MECO USA, Inc. is formed as a holding company
2002
On February 1, MECO USA, Inc., and its affiliated companies, MECO Metal Finishing USA, Inc. and MECO Metal Finishing Illinois, LLC, changed its name to Possehl Connector Services
2007
In December, Possehl Connector Services, Illinois closes and all reel to reel gold and solder plating activities are consolidated into Possehl Connector Services, Rock Hill, SC
2012
Possehl Connector Services, Inc. completes a 20,000 square foot expansion of the plating facilities increasing current plating capacity with 2 additional plating lines with space for an additional 4 lines in the future
2006
Establishment of Technical Plastic Systems S de RL de CV in Puebla, Mexiko
2017
Renaming of Plastic Systems S de RL de CV in Puebla into Possehl Electronics Puebla S. de R.L de C.V on 1. April 2017
3D-Ansicht
